Microcontrollers, Microprocessor, FPGA Modules SOMOMAP3530-11-1782IFXR product image

SOMOMAP3530-11-1782IFXR

$548.25
  • Description:IC MOD CORTEX-A8 600MHZ 256MB
  • Series:OMAP35x

SKU:447484aec120 Category: Brand:

  
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SOMOMAP3530-11-1782IFXR is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Beacon EmbeddedWorks. Its product description is IC MOD CORTEX-A8 600MHZ 256MB. Review the specifications below when checking this part for your BOM.

Microcontrollers, Microprocessor, FPGA Modules specifications for SOMOMAP3530-11-1782IFXR

  • Description:IC MOD CORTEX-A8 600MHZ 256MB
  • Series:OMAP35x
  • Mfr:Beacon EmbeddedWorks
  • Package:Bulk
  • Module/Board Type:MPU, DSP Core
  • Core Processor:ARM® Cortex®-A8, OMAP3530
  • Co-Processor:TMS320C64x (DSP)
  • Speed:600MHz
  • Flash Size:512MB (NAND), 8MB (NOR)
  • RAM Size:256MB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:1.230" L x 3.010" W (31.20mm x 76.50mm)
  • Operating Temperature:-20°C ~ 70°C

Microcontrollers, Microprocessor, FPGA Modules datasheet and documents for SOMOMAP3530-11-1782IFXR

SOMOMAP3530-11-1782IFXR

Microcontrollers, Microprocessor, FPGA Modules Overview

The Beacon EmbeddedWorks SOMOMAP3530-11-1782IFXR is a System on Module (SoM) based on the Texas Instruments OMAP35x processor family, specifically utilizing the superset OMAP3530. It features an ARM Cortex-A8 core running up to 600 MHz and a TMS320C64x DSP core operating at 430 MHz. The module integrates 256 MB of mobile DDR RAM and 512 MB of NAND flash using Package-on-Package technology, alongside 16 MB of NOR flash. It adheres to the compact SOM-LV Type III form factor measuring 31.2 x 76.5 x 7.4 mm. This configuration supports industrial temperature ranges and includes integrated wireless connectivity options.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

  • Dual-core architecture with ARM Cortex-A8 (up to 600 MHz) and TMS320C64x DSP (up to 430 MHz)
  • SOM-LV Type III form factor (31.2 x 76.5 x 7.4 mm) for compact embedded designs
  • Integrated memory: 256 MB mDDR, 512 MB NAND flash, and 16 MB NOR flash
  • Supports Windows Embedded CE 6.0 and open source Linux BSPs

Microcontrollers, Microprocessor, FPGA Modules Applications

  • Medical devices including patient monitoring and medical imaging systems
  • Point-of-sale terminals and barcode readers
  • Industrial control and security applications such as CCTV cameras and intruder alarms

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix against the official Logic PD/Beacon EmbeddedWorks ordering guide to confirm hardware attributes. Key parameters to validate include the processor tier (OMAP3530 vs. OMAP3503), memory capacities, wireless interface availability, and the designated operating temperature range. Ensure compatibility with existing baseboard designs due to the standard SOM-LV Type III footprint.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a combination of high-performance multimedia processing and digital signal processing is required in a small footprint. The inclusion of the C64x DSP makes it suitable for complex audio or video processing tasks. Confirm that the baseboard design supports the specific I/O requirements, such as the 24-bit TFT LCD interface and USB OTG capabilities, inherent to the OMAP3530 processor variant.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This SoM belongs to the OMAP35x SOM-LV product line, designed to reduce development risks associated with the OMAP 3 processor. It allows developers to reuse existing baseboard designs when upgrading processors, extending roadmap possibilities. The module is part of a long-life product lifecycle strategy aimed at handheld and embedded networking markets.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

The SOMOMAP3530-12-1783JFIR serves as a direct functional replacement if an extended industrial temperature range (-40°C to 85°C) is required instead of the commercial range (-20°C to 70°C). Both modules share identical processor, memory, and form factor specifications.

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$548.25
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