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The SP-1609S-2 is a dynamic speaker manufactured by Soberton Inc., designed for mobile telephone applications. It features an 8 Ohm impedance and a rated power of 500 mW, with a maximum short-term power handling of 800 mW. The device operates within a frequency range of 300 Hz to 5 kHz and delivers a sound pressure level (SPL) efficiency of 82 dBA. Measured at 10 cm with a baffle, the SPL averages 82±3 dB across specific frequencies. The unit utilizes a PEEK cone and Nd-Fe-B magnet, with dimensions of 15.00 mm x 11.00 mm and a maximum installation height of 4.00 mm.
Verify the specific datasheet revision against the manufacturer's official documentation to ensure compatibility with current production standards. Confirm that the terminal type matches the intended PCB layout, as specifications may vary between wire leads and solder pads depending on the exact sub-model variant. Ensure environmental operating conditions align with the specified temperature range for reliable performance in the final assembly.
Select this component when a compact rectangular form factor is required for mobile devices. The 8 Ohm impedance and 500 mW rating suit low-power audio circuits. Consider the 300 Hz to 5 kHz frequency response limitations for voice-centric applications rather than full-range music reproduction. Verify mechanical clearance constraints against the 4.00 mm maximum height specification during the design phase.
This part belongs to the SP Micro Speaker series from Soberton Inc., which focuses on dynamic speakers for consumer electronics. The series typically includes various impedance and power ratings tailored for portable devices. The SP-1609S-2 represents a standard offering within this lineup, emphasizing balance between size, cost, and acoustic performance for voice communications.
Direct substitutes are not explicitly confirmed in public documentation. Evaluate other Soberton models with matching 8 Ohm impedance, similar physical dimensions (15x11 mm), and comparable SPL efficiency. Verify that any alternative maintains the same terminal connection style and frequency response characteristics to ensure seamless integration without redesigning the enclosure or circuitry.