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SS10P6HM3_A/H is listed in the Single Diodes range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE SCHOTTKY 60V 7A TO277A. Review the specifications below when checking this part for your BOM.
The SS10P6HM3_A/H is a high current density surface-mount Schottky barrier rectifier manufactured by Vishay General Semiconductor. It features a maximum average forward rectified current of 10 A and a maximum repetitive peak reverse voltage of 60 V. The device utilizes Trench MOS Schottky technology to achieve a low forward voltage drop, with a typical value of 0.55 V at 10 A. It is housed in an SMPC (TO-277A) package and is qualified under the AEC-Q101 standard for automotive applications.
Verify that the specific ordering code matches the required qualification level. The HM3 suffix indicates AEC-Q101 qualification, whereas the M3 suffix denotes commercial grade. Confirm the package revision code and delivery mode align with manufacturing requirements before finalizing procurement orders.
Select this component for designs requiring high efficiency and low forward voltage drop in compact surface-mount layouts. Ensure the operating junction temperature remains within the specified -55 °C to +150 °C range. Verify that the PCB pad layout conforms to JEDEC TO-277A standards for optimal thermal performance and mechanical stability.
This part belongs to the eSMP series of high current density surface-mount Schottky rectifiers. It shares the same physical SMPC package and general feature set as other variants in the series, such as the SS10P5 and SS10P6-M3, differentiated primarily by voltage ratings and automotive qualification status.
Direct substitutes include the SS10P6-M3/86A and SS10P6-M3/87A. Note that these alternatives lack AEC-Q101 automotive qualification. Verify package compatibility and electrical parameters before implementation.
The typical instantaneous forward voltage is 0.55 V when tested at an forward current of 10 A.
Yes, the datasheet specifies that the device is ideal for automated placement due to its very low profile and package design.
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