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The KEMET SS30V-180145 is a surface-mount Schottky barrier rectifier diode designed for high-efficiency power conversion applications. It features a 30-volt maximum repetitive peak reverse voltage and a 3.0-ampere average forward rectified current rating at case temperature. The device utilizes a DO-214AB (SMA) package, providing a compact footprint suitable for automated assembly processes. Key electrical characteristics include a low forward voltage drop to minimize conduction losses and a fast switching speed with low reverse recovery charge, enhancing overall system efficiency in DC-DC converters and freewheeling diode configurations.
Verify the complete part number against official KEMET documentation to ensure correct voltage and current ratings. Confirm package type and tape-and-reel specifications match your manufacturing requirements. Check for any specific ordering suffixes that may indicate packaging variations or environmental compliance status. Ensure storage conditions align with manufacturer guidelines to maintain device integrity before soldering.
Select this component when low forward voltage drop and fast switching are critical for efficiency. Consider the thermal management capabilities of the SMA package for your specific current load. Evaluate the reverse leakage current specifications relative to your operating temperature range. Ensure the peak repetitive reverse voltage exceeds the maximum circuit voltage with adequate safety margin.
This component belongs to KEMET's series of surface-mount Schottky rectifiers. These devices are engineered for general-purpose power supply applications requiring high reliability and efficiency. The series offers various voltage and current ratings to suit different power levels while maintaining consistent performance characteristics across the product line.
Consult official KEMET substitution guides for verified equivalent parts. Ensure replacement components match the original voltage, current, and package specifications. Verify compatibility with existing thermal and mechanical constraints on the printed circuit board.