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SSM2603CPZ-REEL7 is listed in the Codecs range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC CODEC AUDIO LOW POWER 28LFCSP. Review the specifications below when checking this part for your BOM.
The SSM2603CPZ-REEL7 is a low-power stereo audio codec manufactured by Analog Devices Inc. It integrates two 24-bit analog-to-digital converters (ADC) and two 24-bit digital-to-analog converters (DAC). The device supports sampling rates up to 96 kHz with an I2C control interface. Operating voltage ranges from 1.8 V to 3.6 V for analog supplies and 1.5 V to 3.6 V for the digital core. Key performance metrics include a DAC signal-to-noise ratio of 100 dB and an ADC signal-to-noise ratio of 90 dB at 48 kHz. It features a highly efficient headphone amplifier and is housed in a 28-lead, 5 mm × 5 mm LFCSP package.
Verify the component against the official Analog Devices datasheet Rev. D specifications. Confirm that the LFCSP-28 package matches the required footprint and thermal characteristics. Ensure the operating temperature range of -40°C to +85°C aligns with the target application environment. Cross-reference the pinout configuration to guarantee correct PCB layout integration.
Select this component for portable applications requiring high-quality stereo audio conversion with minimal power consumption. Consider the 24-bit resolution and low noise floor for superior audio fidelity. Evaluate the supply voltage requirements to ensure compatibility with the system's power rails. Verify that the I2C interface meets the controller's communication standards.
This part belongs to the SSM2603 series of audio codecs designed for portable electronics. It is specifically engineered to provide high-performance audio processing in a compact form factor. The device is suitable for battery-powered systems due to its low power architecture and efficient power management features.
Check for direct substitutes within the Analog Devices portfolio that share identical pinouts and electrical specifications. Verify compatibility with existing firmware and register maps if replacing with a different revision or variant. Ensure any alternative component meets the same thermal and mechanical constraints.
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