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ST16C554DIQ64TR-F is listed in the UARTs (Universal Asynchronous Receiver Transmitter) range at ChipApex. The manufacturer field lists MaxLinear, Inc.. Its product description is IC UART FIFO 16B QUAD 64LQFP. Review the specifications below when checking this part for your BOM.
The ST16C554DIQ64TR-F is a quad Universal Asynchronous Receiver and Transmitter (UART) manufactured by MaxLinear. It integrates 16 bytes of transmit and receive FIFOs per channel, supporting data rates up to 1.5 Mb/s. The device operates within a supply voltage range of 2.97 V to 5.5 V, with typical operating voltages at 3.3 V or 5 V. It features selectable receive FIFO trigger levels and supports both Intel and Motorola bus protocols. The component is housed in a TQFP-64 surface-mount package and is rated for an industrial temperature range from -40°C to +85°C.
Verify the specific suffix TR-F indicates tape-and-reel packaging when sourcing. Confirm the manufacturer designation as MaxLinear, noting prior Exar Corporation origins for this product line. Ensure compatibility with the TQFP-64 footprint during procurement planning. Check for RoHS compliance documentation relevant to the current production batch.
Select this component when four independent UART channels are required in a single package. The 16-byte FIFO depth is suitable for moderate throughput applications without complex DMA requirements. Verify that the 2.97V to 5.5V supply range matches the system power rails. Consider the -40°C to +85°C temperature rating for industrial environments.
This part belongs to the ST16C554D series of quad UARTs. It is functionally similar to other variants like the ST16C554DCQ64-F but differs in package type and temperature grade. The DIQ64 designation specifically refers to the TQFP-64 package variant. This series is widely used in legacy and modern embedded designs requiring robust serial connectivity.
The ST16C554DCQ64-F is a documented alternative offering similar functionality in a LQFP-64 package. Verify pin-to-pin compatibility if substituting into existing PCB layouts. Ensure the temperature range and FIFO specifications meet the application requirements before replacement.
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