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ST3-12B5 is listed in the Power Transformers range at ChipApex. The manufacturer field lists Pulse Electronics. Its product description is PWR XFMR LAMINATED 2.4VA TH. Review the specifications below when checking this part for your BOM.
The ST3-12B5 is a laminated core power transformer designed for board mounting via through-hole termination. It features a split bobbin construction with a rated power of 2.4VA and an isolation voltage of 2500Vrms. The primary winding supports 115V input. Secondary outputs are configured for parallel connection at 6.3V with 400mA capacity, or series connection at 12.6V with 200mA capacity. The component utilizes PC pin terminals for secure circuit integration.
Verify the obsolete lifecycle status before procurement planning. Confirm regional availability as distribution may be restricted in certain areas. Ensure the specific secondary configuration (parallel vs. series) matches the target circuit requirements. Validate RoHS compliance documentation for regulatory adherence. Cross-reference datasheet specifications against current inventory listings to confirm physical condition.
Select this component when a 2.4VA laminated transformer is required for low-frequency applications. The split bobbin architecture suits designs needing reduced parasitic capacitance. Through-hole termination is appropriate for high-vibration environments. Verify that the 115V primary voltage aligns with the source supply. Ensure the secondary current ratings meet the load demands in the chosen wiring configuration.
This part belongs to Pulse Electronics' power transformer portfolio, specifically within the board-mount category. It serves as a legacy component for industrial and commercial power supplies. The laminated core technology distinguishes it from modern ferrite-based alternatives, offering specific performance characteristics for lower frequency operations.
As the part is marked obsolete, direct substitutes must be sourced from official manufacturer cross-reference lists. Verify electrical equivalence regarding VA rating, isolation voltage, and winding configuration. Physical footprint compatibility is critical for existing PCB layouts.
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