ST33KTPM2X32DKG9

ST33KTPM2X32DKG9

$3.41
  • Description:TPM 2.0 DEVICE FOR CONSUMER
  • Series:-

SKU:776ab2f1c948 Category: Brand:

  
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Product Detailed Parameters

  • Description:TPM 2.0 DEVICE FOR CONSUMER
  • Series:-
  • Mfr:STMicroelectronics
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Applications:Trusted Platform Module (TPM)
  • Core Processor:ARM® SecurCore® SC300
  • Program Memory Type:-
  • Controller Series:ST33K
  • RAM Size:-
  • Interface:I2C, SPI
  • Number of I/O:7
  • Voltage - Supply:1.8V, 3.3V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:32-UFQFN Exposed Pad
  • Supplier Device Package:32-UFQFPN (5x5)
  • Grade:-
  • Qualification:-

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ST33KTPM2X32DKG9

Overview

The ST33KTPM2X32DKG9 is a flash memory-based Trusted Platform Module (TPM) compliant with TCG TPM Library specifications 2.0, revision 1.59 errata version 1.5, and PTP for TPM 2.0 Version 1.06. It supports SPI communication at up to 66 MHz and I²C at up to 1 Mb/s. The device operates within an extended temperature range of –40 °C to 105 °C and accepts a 1.8 V or 3.3 V supply voltage. It targets Common Criteria EAL4+ and FIPS 140-3 physical security level 3 certifications.

Feature Summary

  • Compliant with TCG TPM Library 2.0 (rev 1.59 errata 1.5) and PTP v1.06
  • Fault-tolerant firmware loader with self-recovery capabilities upon failure detection
  • Supports RSA key generation (up to 4096 bits), ECC (NIST P_256/384/521), AES, SHA, and HMAC algorithms
  • Includes deterministic (DRBG) and true random number generators (TRNG) compliant with NIST SP800-90A/B and AIS standards

Applications

  • Embedded systems requiring hardware-based identity protection
  • PC and mobile computing platforms needing secure boot and data integrity
  • IoT devices utilizing Microsoft Windows 10/11 or Linux driver ecosystems

Procurement Notes

Verify the factory firmware version associated with the ordering code ST33KTPM2X32DKG9, which corresponds to version 0x00.09.01.01 (9.257). Confirm that the UFQFPN32 package dimensions and tape-and-reel specifications align with the target PCB design requirements before finalizing procurement.

Selection Notes

Select this component when both SPI and I²C interface options are required on the same silicon die. Ensure the application environment remains within the –40 °C to 105 °C operating range. Verify that the host system can provide the necessary power supply filtering and rising slope constraints specified in the electrical integration guidance.

Part Context

This part belongs to the STSAFE-TPM family, designed for consumer active applications. It shares identical functional features with the ST33KTPM2XI2C but is produced at different manufacturing sites. The device integrates four endorsement keys (EK) and three pre-provisioned 2048-bit RSA key pairs to reduce provisioning time.

Replacement Considerations

The ST33KTPM2X32DKJ1 serves as a direct replacement option, differing only in the factory firmware version (0x00.09.02.00 vs 0x00.09.01.01). Both parts utilize the same UFQFPN32 package and support identical cryptographic features and interfaces.

ST33KTPM2X32DKG9ST33KTPM2X32DKG9
$3.41
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