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The ST33KTPM2X32DKG9 is a flash memory-based Trusted Platform Module (TPM) compliant with TCG TPM Library specifications 2.0, revision 1.59 errata version 1.5, and PTP for TPM 2.0 Version 1.06. It supports SPI communication at up to 66 MHz and I²C at up to 1 Mb/s. The device operates within an extended temperature range of –40 °C to 105 °C and accepts a 1.8 V or 3.3 V supply voltage. It targets Common Criteria EAL4+ and FIPS 140-3 physical security level 3 certifications.
Verify the factory firmware version associated with the ordering code ST33KTPM2X32DKG9, which corresponds to version 0x00.09.01.01 (9.257). Confirm that the UFQFPN32 package dimensions and tape-and-reel specifications align with the target PCB design requirements before finalizing procurement.
Select this component when both SPI and I²C interface options are required on the same silicon die. Ensure the application environment remains within the –40 °C to 105 °C operating range. Verify that the host system can provide the necessary power supply filtering and rising slope constraints specified in the electrical integration guidance.
This part belongs to the STSAFE-TPM family, designed for consumer active applications. It shares identical functional features with the ST33KTPM2XI2C but is produced at different manufacturing sites. The device integrates four endorsement keys (EK) and three pre-provisioned 2048-bit RSA key pairs to reduce provisioning time.
The ST33KTPM2X32DKJ1 serves as a direct replacement option, differing only in the factory firmware version (0x00.09.02.00 vs 0x00.09.01.01). Both parts utilize the same UFQFPN32 package and support identical cryptographic features and interfaces.