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STA016T is listed in the Encoders, Decoders, Converters range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC DECODER AUDIO 2.5 64TQFP. Review the specifications below when checking this part for your BOM.
The STA016T is a single-chip MPEG audio decoder integrated circuit manufactured by STMicroelectronics. It supports MPEG-1, MPEG-2, and MPEG-2.5 Layer III audio decoding standards with embedded CD-ROM decoding capabilities. The device accepts serial bitstream input and provides digital PCM output via an I2S interface. It features digital volume control, bass and treble adjustment, and ancillary data extraction through an I2C bus. Designed for low-power applications using 3.3V CMOS technology, it includes internal PLLs for clock generation and error detection mechanisms.
Verify the specific suffix 'T' indicates the tape-and-reel packaging variant when sourcing. Confirm that the component matches the 64-LQFP package dimensions and pinout requirements for your PCB layout. Ensure compatibility with the required external clock frequencies or oscillator configurations as specified in the official datasheet before finalizing procurement.
Select this component for systems requiring standalone MPEG Layer III decoding without external DSP resources. Consider its 3.3V operation and low power consumption suitable for portable or space-constrained designs. Verify support for the specific sampling rates and bitrates needed for your target audio content format.
The STA016T belongs to STMicroelectronics' family of multimedia interface ICs designed for audio processing. It complements other decoders like the STA013 by offering similar MPEG Layer III functionality within a single chip architecture. This part serves as a dedicated solution for integrating high-quality audio playback into consumer electronics and computer peripherals.
The STA013 is a documented substitute within the same product family offering comparable MPEG Layer III decoding capabilities. Verify pin-to-pin compatibility and software configuration differences before swapping components in existing designs.
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