SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
STA8090F4GB is listed in the RF Receivers range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is FULLY INTEGRATED GPS/GALILEO/GLO. Review the specifications below when checking this part for your BOM.
The STA8090F4GB is a fully integrated GNSS receiver from STMicroelectronics, supporting GPS, Galileo, GLONASS, BeiDou2, and QZSS. It features an embedded RF front-end and in-pack antenna interface within a 6 mm x 5 mm x 1.2 mm TFBGA-99 package. The device operates on a 1.1 V supply with a maximum frequency of 196 MHz. Key electrical parameters include a noise figure of 2 dB and bandwidths of 2.4 MHz or 4.8 MHz. It supports interfaces including CAN, GPIO, I2C, SPI, UART, and USB, functioning within a temperature range of -40°C to +85°C.
Verify the specific ordering suffix 'F4GB' against the official datasheet to confirm the tray packaging configuration. Ensure compatibility with the required interface protocols such as CAN or SPI. Confirm that the TFBGA-99 package dimensions align with the PCB footprint. Validate moisture sensitivity levels and reflow soldering profiles before production integration.
Select this component when a compact, single-die solution with embedded RF is required for multi-constellation positioning. Consider the TFBGA-99 package size constraints and the need for in-pack antenna integration. Evaluate the 1.1 V operating voltage against system power rails. Ensure the application benefits from the low noise figure and high sensitivity characteristics provided by the integrated architecture.
This part belongs to the STA8090FG series of GNSS receivers. It represents a standalone positioning engine designed for space-constrained applications. The device integrates an ARM946 MCU core with embedded memory, distinguishing it from simpler passive modules. It is engineered for automotive and industrial environments requiring robust signal acquisition across diverse satellite constellations.
The STA8090F4GBTR is a functionally equivalent variant offered in tape-and-reel packaging instead of trays. Both parts share identical electrical specifications and pinouts. Verify that the manufacturing lot and packaging format meet the assembly line requirements without altering the circuit design.
Explore related parts through RF and Wireless, all product categories, ChipApex homepage.