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STA8100GATR is listed in the RF Receivers range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is LINEAR IC'S. Review the specifications below when checking this part for your BOM.
The STA8100GATR is an automotive-grade, multi-band, multi-constellation GNSS positioning receiver IC from STMicroelectronics' Teseo V family. It integrates an ARM Cortex-M7 core operating at a maximum frequency of 314 MHz with 256 KB system RAM and dedicated memory interfaces. The device supports GPS, Galileo, GLONASS, BeiDou, QZSS, and NAVIC across L1, L2, L5, and E6 bands using 80 tracking channels. It operates within a supply voltage range of 1.71 V to 3.6 V and withstands temperatures from -40°C to 105°C in an 81-ball LFBGA package.
Verify the specific suffix 'GATR' corresponds to the tape-and-reel packaging configuration required for automated assembly processes. Confirm that the component meets AEC-Q100 Grade 1 specifications for the intended automotive application environment. Ensure compatibility with the required firmware updates for supported constellations before integration into final designs.
Select this component when designing for high-precision automotive positioning requiring simultaneous multi-band signal processing. The integrated Cortex-M7 core allows for complex dead reckoning algorithms without external processors. Consider the 81-ball LFBGA package constraints for PCB layout and thermal management requirements in confined automotive enclosures.
This part belongs to the Teseo V family of GNSS receivers, representing STMicroelectronics' fifth-generation positioning technology. It succeeds previous generations by offering enhanced channel counts and lower power consumption while maintaining automotive qualification. The family includes variants supporting different packaging options and feature sets for diverse market segments.
Direct substitutes include other STA8100 series variants such as STA8100GA or STA8100GAS, depending on packaging preferences. Cross-family replacements may require significant firmware and hardware redesign due to differences in pinout and core architecture.
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