STHVUP32

Overview

The STHVUP32 is a 32-channel monolithic high-voltage and high-speed pulser with an integrated transmit beamformer, designed for multi-channel low-power ultra-portable medical ultrasound applications. It generates waveforms using sequences of up to 32 states stored in device memory. Each channel features four half-bridges capable of ±100 V output. In 3-level mode, peak current ranges from ±200 mA to ±800 mA; in 5-level mode, each bridge provides ±200 mA. The device includes a 23 Ω clamping circuit with 0.64 A capability, independent T/R switches, and noise-blocking diodes.

Feature Summary

• 32 channels with programmable 3-level (±200/400/600/800 mA) or 5-level (±200 mA per bridge) output configurations
• Integrated transmit beamformer with up to 200 MHz clock frequency and 5 ns delay resolution
• Embedded memory storing up to 32 waveform states with compression algorithm and support for four distinct waveforms per channel
• Fully integrated 23 Ω transmitting/receiving switches and real clamping-to-ground function

Applications

• Medical ultrasound imaging
• Ultra-portable ultrasound imaging systems
• Pulse waveform generators
• Piezoelectric transducer drivers

Procurement Notes

Verify the package type matches the required 168-LFBGA (FCBGA) form factor measuring 11.5 mm x 10.5 mm x 1.35 mm. Confirm that the specific revision of the datasheet aligns with the manufacturing date code. Ensure supply chain documentation supports the intended industrial or medical grade requirements without relying on generic family specifications.

Selection Notes

Select this component when designing multi-channel portable ultrasound systems requiring integrated beamforming. Choose the 3-level mode for higher peak currents up to 800 mA or the 5-level mode for independent bridge control. Verify that the system power budget accommodates the selected current configuration and that the QSPI interface compatibility meets the controller requirements.

Part Context

The STHVUP32 belongs to ST's specialized ultrasound imaging IC solutions, specifically the STHVUP series optimized for portability. It utilizes proprietary BCD6s-SOI technology to combine high-voltage power stages with low-voltage CMOS logic. This integration reduces external component count compared to discrete solutions, supporting compact designs for point-of-care diagnostic equipment.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Evaluate alternative ST models such as the STHV800 for lower channel counts or the STHV1600 for different topologies based on specific application constraints.