STK433-330N-E

Overview

The STK433-330N-E is a hybrid integrated circuit designed for high-power audio applications. It integrates three independent Class AB amplifier channels, delivering up to 150W per channel into a 6-ohm load. The device operates within a supply voltage range of 10V to 46V and features a 19-pin Single In-line Package (SIP). Designed for through-hole mounting, it supports a maximum operating temperature of +125°C and draws an operating supply current of 120 mA.

Feature Summary

• Integrates three independent Class AB amplifier channels in a single hybrid package
• Capable of delivering high output power suitable for multi-channel audio systems
• Designed with robust thermal characteristics for high-temperature operation

Applications

• High-power audio amplifiers
• Multi-channel sound reinforcement systems
• Professional audio equipment

Procurement Notes

Verify the specific suffix and marking against the official onsemi datasheet to ensure authenticity. Confirm that the 19-SIP package dimensions match your PCB footprint requirements. Check for any obsolescence notices or lifecycle status updates directly from the manufacturer before finalizing procurement plans.

Selection Notes

Select this component when designing systems requiring discrete integration of multiple high-power amplifier channels. Ensure the heat sinking solution accommodates the thermal dissipation needs of a 150W x 3 configuration. Verify that the power supply can maintain stability within the 10V to 46V input range under full load conditions.

Part Context

This part belongs to onsemi's portfolio of hybrid ICs and audio amplifiers. It is categorized under standard products and signal conditioning solutions. The device utilizes SIP packaging technology to provide a compact solution for high-power analog circuits in industrial and consumer electronics.

Replacement Considerations

Consult official cross-reference lists for verified substitutes. Ensure any replacement maintains the 19-SIP pinout compatibility and Class AB topology to avoid redesigning the surrounding circuitry.