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The STK551-391A1-E is a three-phase intelligent power module (IPM) manufactured by onsemi. It integrates high-voltage silicon IGBTs with dedicated driver circuits for motor control applications. The device features a collector-emitter maximum voltage of 600 V and supports a continuous collector current of 20 A. Designed for through-hole mounting in an SIP-29 package, it operates within a temperature range of -40°C to +100°C. The module dissipates up to 39 W of power and utilizes standard silicon technology for robust performance in industrial motor drive systems.
Verify the exact suffix against official onsemi documentation, as variations like STK551U3A2A-E or STK551-391A-E may exist within the family. Confirm RoHS compliance status directly from the manufacturer's datasheet before integration. Ensure the SIP-29 footprint matches your board design requirements. Check for end-of-life notices or obsolescence warnings, as availability may be limited for older IPM series.
Select this component when a compact, integrated solution for three-phase motor control is required. The 600 V rating suits medium-voltage applications, while the 20 A current capacity supports moderate power loads. Consider the SIP-29 package size for space-constrained designs. Evaluate thermal dissipation needs against the 39 W power rating and ensure adequate heatsinking is planned for operation near the upper temperature limit.
This part belongs to onsemi's STK551 series of intelligent power modules, which are designed to simplify the implementation of three-phase inverters. These modules combine power switching devices with control logic to reduce component count and design complexity. The series is widely used in applications requiring reliable motor control with built-in protection mechanisms, serving as a key building block in modern power electronics systems.
Direct substitutes include other onsemi STK551 series variants such as STK551-391A-E or STK551U3A2A-E, provided pinouts and electrical ratings match. Cross-brand replacements require careful verification of IGBT characteristics, driver thresholds, and package dimensions to ensure functional compatibility without redesigning the host circuit.