STTD6050H-12M2Y

$19.04

Description：60 A 1200 V HALF-CONTROLLED BRID
Series：-

SKU:b031b3b55e0e Category: SCRs - Modules Brand: STMicroelectronics

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Product introduction

Product Detailed Parameters

Description：60 A 1200 V HALF-CONTROLLED BRID
Series：-
Mfr：STMicroelectronics
Package：Tape & Reel (TR),Cut Tape (CT)
Structure：Bridge, Single Phase - SCRs/Diodes (Layout 1)
Number of SCRs, Diodes：2 SCRs, 2 Diodes
Voltage - Off State：1.2 kV
Current - On State (It (AV)) (Max)：38 A
Current - On State (It (RMS)) (Max)：60 A
Current - Non Rep. Surge 50, 60Hz (Itsm)：500A, 525A
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Surface Mount
Package / Case：9-PowerSMD
Voltage - Gate Trigger (Vgt) (Max)：1.3 V
Current - Gate Trigger (Igt) (Max)：50 mA
Current - Hold (Ih) (Max)：100 mA
Grade：Automotive
Qualification：AEC-Q101

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STTD6050H-12M2Y

Overview

The STTD6050H-12M2Y is a half-controlled bridge rectifier module rated at 1200 V with an RMS current of 60 A and an average output DC current up to 75 A. It integrates two TN6050HP-12 SCRs and two STBR6012 diodes within an ACEPACK SMIT package. The device features a maximum junction temperature of 150 °C, static dV/dt immunity of 1000 V/μs, and a non-repetitive surge peak off-state voltage of 1400 V. It includes a 4000 V insulated tab-to-lead isolation and meets AEC-Q101 automotive qualification standards.

Feature Summary

Integrates two thyristors and two diodes in a single surface-mount module for compact design
Features high noise immunity with a static dV/dt rating of 1000 V/μs
Includes an isolated top-cooled tab enabling automatic PCB-to-heatsink mounting
Complies with AQG324 recommendations for automotive applications

Applications

Single-phase controlled bridge rectifiers
On-board and stationary battery chargers
AC-DC converters for motor drives, UPS, and switch-mode power supplies

Procurement Notes

Verify the specific datasheet revision (DS13702 Rev 2) against the manufacturer's official website prior to procurement. Confirm that the Y suffix corresponds to the required AEC-Q101 automotive grade qualification. Ensure thermal interface materials are compatible with the specified 50 N pressing force requirement for the ACEPACK SMIT package to maintain optimal heat dissipation performance.

Selection Notes

Select this component when designing systems requiring a compact, thermally efficient solution for AC input conversion. The integrated SCR and diode configuration simplifies gate drive circuitry compared to discrete implementations. Consider the 150 °C junction temperature capability for high-temperature environments and verify that the 1200 V blocking voltage aligns with the peak line voltages of the target application.

Part Context

This module belongs to STMicroelectronics' ACEPACK SMIT family, designed specifically for high-power density applications. It utilizes planar technology to enhance robustness against electrical stress. The packaging allows for direct mounting to a heatsink via the top tab, reducing the overall profile compared to traditional through-hole or multiple TO-247 configurations.