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SX3B13.560F2010F30 is listed in the Crystals range at ChipApex. The manufacturer field lists Shenzhen SCTF Electronics. Its product description is CRYSTAL 13.5600MHz 20pF SMD. Review the specifications below when checking this part for your BOM.
The SX3B13.560F2010F30 is a surface-mount crystal oscillator manufactured by Shenzhen SCTF Electronics, designed for compact electronic applications. It operates at a nominal frequency of 13.56 MHz with a tolerance of ±10 ppm. The device utilizes an AT-cut crystal structure housed in a super-small ceramic package with a metal cover, suitable for high-temperature environments. Key electrical parameters include a load capacitance of 20 pF and a drive level of 100 Ohms. The component is available in a 4-SMD, No Lead package configuration, facilitating automated assembly processes.
Verify the specific ordering suffix to ensure the correct load capacitance and tolerance match your design requirements. Confirm the package dimensions against your PCB footprint library before finalizing procurement. Ensure the operating temperature range aligns with your system's environmental specifications. Cross-reference the datasheet for any changes in pinout or mounting recommendations.
Select this component when a 13.56 MHz reference signal is required in space-constrained designs. Consider the ±10 ppm tolerance for frequency stability needs. The SMD form factor supports reflow soldering processes. Evaluate thermal performance if the application involves sustained high-temperature operation.
This part belongs to the SX3B series of surface-mount crystal oscillators from Shenzhen SCTF Electronics. The series is characterized by its small footprint and robust construction, utilizing AT-cut crystals. These components are engineered to provide reliable frequency generation in modern electronics where size and reliability are critical factors.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing designs by matching frequency, load capacitance, and package dimensions.
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