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SX8724E082TDT is listed in the Sensor And Detector Interfaces range at ChipApex. The manufacturer field lists Semtech Corporation. Its product description is IC DAS PRESS/TEMP SENS 16MLPQ. Review the specifications below when checking this part for your BOM.
The SX8724E082TDT is a data acquisition system utilizing Semtech’s ZoomingADC™ technology, designed for direct connection to miniature sensors. It features up to 16-bit differential data acquisition with programmable gain ranging from 1/12 to 1000 V/V. The device supports 3 differential or 6 single-ended signal inputs and includes sensor offset compensation up to 15 times the full-scale input signal. Operating on a power supply of 2.4V to 5.5V, it achieves low-power consumption of 250 µA at 16-bit resolution and 500 S/s sampling rate. Communication is handled via a 2-wire interface supporting clock frequencies up to 400 kHz.
Verify that the ordering suffix TDT corresponds to the MLPQ-16 4x4 package with a reel quantity of 1000 units. Confirm RoHS compliance and lead-free status as specified in the manufacturer's documentation. Ensure the component meets the required operating temperature range of -40°C to 125°C for your specific application environment.
Select this model when interfacing with Wheatstone bridges or single-ended sensors requiring high-gain acquisition. Consider the MLPQ-16 4x4 package constraints and the need for a 2-wire compatible microcontroller. Evaluate if the 3 differential input channels and 4 digital GPIO pins suffice for your sensor array and control requirements.
This component belongs to the SX8724 series of advanced communications and sensing devices. It shares the core ZoomingADC technology found in related models like the SX8722 but offers specific input configurations tailored for pressure and temperature sensing applications. The E082 designation indicates specific manufacturing lot and date code parameters.
The SX8724E082TRT is a tape and reel alternative with a 3000-unit quantity in the same MLPQ-16 4x4 package. Verify pin compatibility and register mapping before substitution. No other cross-model replacements are confirmed in the provided documentation.
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