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Product Detailed Parameters
- Description：LUMPED LC LPF, DC - 11 MHZ, 50
- Series：-
- Mfr：Mini-Circuits
- Package：Strip
- Frequency：14MHz (Cutoff)
- Bandwidth：-
- Filter Type：Low Pass
- Ripple：-
- Insertion Loss：-
- Mounting Type：Surface Mount
- Package / Case：8-SMD, No Lead
- Size / Dimension：0.740" L x 0.440" W (18.80mm x 11.18mm)
- Height (Max)：0.270" (6.86mm)
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Overview
The SXLP-10.7+ is a lumped LC low pass filter manufactured by Mini-Circuits, designed for radio frequency applications. It features a DC to 11 MHz passband and a 50Ω impedance. The device has a cutoff frequency of 14 MHz and is housed in an 8-SMD, no lead surface-mount package.
Feature Summary
- Lumped LC architecture for effective signal conditioning
- Surface-mount design for compact integration
- 50Ω impedance matching for RF systems
Applications
- Radio frequency signal conditioning
- Wireless communication equipment
- Test and measurement devices
Procurement Notes
Verify the exact part number against official Mini-Circuits documentation to ensure compatibility with your specific circuit requirements. Confirm that the 8-SMD package style meets your board layout constraints. Check for any specific handling instructions related to surface-mount components during assembly.
Selection Notes
Select this component when a low-pass filter with a cutoff near 14 MHz is required. Ensure the system operates within the 50Ω impedance standard. Verify that the surface-mount form factor aligns with your manufacturing capabilities and space limitations on the printed circuit board.
Part Context
This component belongs to Mini-Circuits' SXLP series of lumped LC filters. These filters are engineered for high performance in RF and IF applications. The series offers various cutoff frequencies to suit different bandwidth needs while maintaining consistent impedance characteristics across the product line.
Replacement Considerations
Consult Mini-Circuits documentation for direct substitutes. Alternative models may include other SXLP variants with adjusted cutoff frequencies or different packaging options if the current specification does not fully meet application requirements.
