SXT32412ED38-22.1184M

Crystals Overview

The SXT32412ED38-22.1184M is a surface-mount crystal oscillator manufactured by Suntsu Electronics, Inc. It operates at a fundamental frequency of 22.1184 MHz with a load capacitance of 12 pF and an equivalent series resistance of 50 Ohms. The component features a tolerance of ±15 ppm and a stability of ±20 ppm across the operating temperature range of -30°C to +85°C. It utilizes a 4-SMD, No Lead package with dimensions of 3.20mm x 2.50mm.

Crystals Feature Summary

• Surface-mount design for automated assembly
• Wide industrial temperature range operation
• High frequency stability specifications

Crystals Applications

• Clock generation for microprocessors
• Communication interface timing circuits
• Digital signal processing systems

Crystals Procurement Notes

Verify the specific suffix and tolerance requirements against the target circuit design before ordering. Confirm that the 12 pF load capacitance matches the host device's input specifications. Ensure the 50 Ohm ESR is compatible with the oscillator circuit's drive level constraints to prevent frequency pulling or failure to start.

Crystals Selection Notes

Select this component when a precise 22.1184 MHz reference is required in space-constrained designs. The ±15 ppm initial tolerance suits applications demanding tight frequency accuracy. The -30°C to +85°C range supports industrial environments where standard commercial grade parts may fail due to thermal stress.

Crystals Part Context

This part belongs to the SXT324 series of surface-mount crystals from Suntsu Electronics. The series offers various frequency options and package sizes optimized for high-volume manufacturing. The SXT32412ED38 variant specifically targets applications requiring robust performance in moderate industrial conditions.

Crystals Replacement Considerations

Direct substitutes include other 22.1184 MHz crystals with identical 12 pF load capacitance and 50 Ohm ESR. Verify pin compatibility and mechanical footprint alignment. Alternative packages require re-evaluation of soldering profiles and board layout constraints.