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SXT32418DB27-52.000M is listed in the Crystals range at ChipApex. The manufacturer field lists Suntsu Electronics, Inc. Its product description is CRYSTAL 52.000MHZ 18PF SMD. Review the specifications below when checking this part for your BOM.
The SXT32418DB27-52.000M is a surface-mount crystal oscillator manufactured by Suntsu Electronics, Inc. It operates at a fundamental frequency of 52.000 MHz with a load capacitance of 18 pF and an equivalent series resistance (ESR) of 35 Ohms. The component utilizes a 4-SMD, No Lead package configuration, specifically identified as the SMD3225-4P form factor. This device provides a frequency stability of ±20 ppm and functions within an operating temperature range of -20°C to +70°C.
Verify the specific suffix designation against the manufacturer's current datasheet to ensure compatibility with required tolerance and temperature specifications. Confirm that the 4-SMD no-lead package dimensions align with the target PCB land pattern. Request official documentation to validate the ESR and load capacitance values for circuit simulation accuracy before finalizing procurement orders.
Select this component when a 52 MHz reference is required in a compact surface-mount format. Ensure the application environment remains within the specified -20°C to +70°C operational range. Verify that the system driver circuit can adequately support the 18 pF load capacitance and 35 Ohm ESR characteristics to maintain stable oscillation without overdriving the crystal element.
This part belongs to Suntsu Electronics' SXT series of surface-mount crystals. The series offers various frequency options and package styles designed for high-volume consumer and industrial electronics. The DB27 suffix typically denotes specific packaging or tape-and-reel configurations within the product line, distinguishing it from bulk-packed variants.
Direct substitutes must match the 52 MHz frequency, 18 pF load capacitance, 35 Ohm ESR, and 4-SMD no-lead package dimensions. Verify that alternative manufacturers offer components with identical electrical parameters and thermal ratings to ensure seamless integration without redesigning the host circuit board layout.
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