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Product Detailed Parameters
- Description：IC RECEIVER DIFF PECL/ECL 8-MLF
- Series：SY89
- Mfr：Microchip Technology
- Package：Tape & Reel (TR),Cut Tape (CT),Cut Tape (CT)
- Logic Type：Differential Receiver
- Supply Voltage：3V ~ 5.5V
- Number of Bits：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：8-VFDFN Exposed Pad, 8-MLF®
- Supplier Device Package：8-MLF® (2x2)
- Grade：-
- Qualification：-
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Overview
The SY89307VMG-TR is a differential receiver manufactured by Microchip Technology, functionally equivalent to the SY100EP16VS. It supports 3.3V and 5V power supplies with a maximum throughput of 2.5Gbps. The device features fast output transitions under 160ps and 100k compatible PECL/ECL I/O. It operates within a temperature range of –40°C to +85°C and is housed in an ultra-small 8-pin MLF® (2mm x 2mm) package.
Feature Summary
- Features variable output swing capability from 100mV to 700mV controlled via a voltage input.
- Provides fast output transitions with rise/fall times less than 160ps.
- Compatible with 100k PECL/ECL logic standards for high-speed signal interfacing.
Applications
- Multimode optical transceiver
- VCSEL driver
- Backplane receiver
Procurement Notes
Verify that the component matches the specific Pb-Free variant indicated by the 'G' suffix in the part number. Confirm the package type is the 8-lead MLF® configuration. Ensure compatibility with the required operating voltage range of 3.3V or 5V. Check datasheet specifications for thermal management requirements regarding the exposed pad connection.
Selection Notes
Select this component when a compact differential receiver with adjustable output amplitude is required. It serves as a direct functional replacement for the SY100EP16VS in designs needing reduced footprint. Consider its suitability for driving VCSEL lasers where variable swing control is necessary. Verify interface compatibility with existing PECL or ECL logic levels.
Part Context
This device belongs to the Precision Edge family of high-speed logic components originally developed by Micrel, now produced by Microchip Technology. It is designed for applications requiring precise timing and signal integrity in small form factors. The MLF packaging allows for significant board space savings compared to traditional leaded packages.
Replacement Considerations
Functionally equivalent parts include the SY88927V and SY100EP16VS. These alternatives offer similar performance characteristics but may differ in package dimensions or pinout configurations. Verify mechanical fit and electrical parameters before substitution.
