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T1050-8G-TR is listed in the Triacs range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is TRIAC ALTERNISTOR 800V 10A D2PAK. Review the specifications below when checking this part for your BOM.
The T1050-8G-TR is a Snubberless Triac from STMicroelectronics, rated for 800 V repetitive off-state voltage and 10 A RMS on-state current. It operates within a junction temperature range of -40°C to +125°C and utilizes a D2PAK surface-mount package. Key electrical parameters include a maximum non-repetitive peak surge current of 105 A, an on-state voltage of 1.55 V, and a gate trigger voltage of 1.3 V. The device features low thermal resistance through clip bonding and includes an internal ceramic pad providing 2500 V RMS insulation compliance with UL standards.
Verify the specific ordering suffix against official manufacturer documentation to confirm packaging configuration. The TR suffix indicates tape and reel packaging, which differs from tube packaging found in other variants. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration into the assembly process.
Select this component for applications requiring reliable switching of inductive loads without external snubber networks. Ensure the circuit design accommodates the 105 A non-repetitive surge capability and maintains junction temperatures within the specified operational limits. Verify that the D2PAK footprint matches the PCB layout constraints and thermal management strategy.
This part belongs to the T10xx Triac series, designed for general-purpose mains power AC switching. The series includes both through-hole and surface mount options, with the Snubberless versions specifically engineered for superior commutation characteristics compared to standard triacs.
Compatible alternatives within the same family include T1050-8G (tube packaging) and T1050H series variants offering different thermal ratings. Verify pinout compatibility and thermal resistance specifications when substituting.
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