T1250H-6T

Triacs Overview

The T1250H-6T is a Snubberless Triac from the STMicroelectronics H-Series, rated for 600 V and 12 A. It utilizes a TO-220AB package with a maximum junction temperature of 150 °C. Key electrical parameters include a gate trigger voltage of 1 V and a gate trigger current of 50 mA. The device features a holding current of 75 mA and an on-state voltage of 1.5 V. It operates within a temperature range of -40 °C to +125 °C.

Triacs Feature Summary

• Snubberless design optimized for high commutation performance on inductive loads
• High thermal stability supporting operation up to 150 °C junction temperature
• Logic-level gate drive capability for direct microcontroller interfacing

Triacs Applications

• Static relays and mains power AC switching
• Heating regulation systems
• Induction motor starting circuits
• Phase control operations in light dimmers
• Appliance motor speed controllers

Triacs Procurement Notes

Verify the specific suffix 'T' against official STMicroelectronics documentation to confirm the tape-and-reel packaging variant versus tube packaging. Ensure the selected component matches the required thermal management specifications for the intended application environment.

Triacs Selection Notes

Select this component for applications requiring robust AC switching with high commutation capabilities. The Snubberless feature reduces external component count. Verify that the 12 A RMS current rating and 600 V blocking voltage align with the load requirements and line voltage conditions.

Triacs Part Context

This part belongs to the T12xx Triac series, which includes variants like T1250H-6G and T1250H-6I. These devices are designed for general-purpose mains power AC switching. The H-Series designation indicates enhanced thermal and electrical characteristics suitable for demanding industrial and consumer applications.

Triacs Replacement Considerations

Compatible substitutes include T1250H-6G (D2PAK package) and T1250H-6I (TO-220-3 package). Verify pinout compatibility and thermal resistance differences when substituting between surface-mount and through-hole packages.