SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
T13F169C4 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is IC FPGA 73 I/O 169FBGA. Review the specifications below when checking this part for your BOM.
The Efinix T13F169C4 is a Titanium FPGA featuring 16,896 logic elements and 2.5 Mbits of embedded RAM. It operates within a supply voltage range of 0.92V to 0.98V and supports up to 169 user I/Os. The device integrates 12 DSP slices and includes an on-chip oscillator. It is housed in a 169-ball FBGA package with dimensions of 13x13mm. The component supports JTAG programming and offers high-density interconnect capabilities suitable for complex digital designs.
Verify the specific suffix 'C4' against official Efinix documentation to confirm temperature grade and package variant. Ensure compatibility with required programming cables and software versions. Check for RoHS compliance status as per current manufacturer declarations. Confirm lead times directly with authorized distributors as standard delivery periods may vary.
Compare logic element count and RAM capacity against project requirements to ensure sufficient resources. Evaluate pin count availability for interface connections. Consider power consumption profiles at target operating frequencies. Verify support for necessary protocol standards such as SPI, I2C, or Ethernet MAC integration.
This part belongs to the Efinix Titanium family, designed for mid-range FPGA applications requiring moderate logic density and low power consumption. It serves as an upgrade path from smaller Titan devices while offering more resources than entry-level models. The series emphasizes flexibility for diverse digital logic implementations.
The datasheet specifies timing characteristics for various clock networks, but exact maximum frequencies depend on the specific design implementation and routing constraints.
Yes, the Titanium FPGA architecture includes built-in debug features accessible via the JTAG interface for configuration and runtime monitoring.
The physical package dimensions are 13mm by 13mm with a ball pitch of 1.0mm.
Explore related parts through Embedded, Integrated Circuits (ICs), all product categories, ChipApex homepage.