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T1635H-8G is listed in the Triacs range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is TRIAC 800V 16A D2PAK. Review the specifications below when checking this part for your BOM.
The T1635H-8G is a medium current Triac housed in a D²PAK package, designed for operation at 800 V and a maximum junction temperature of 150 °C. It features an RMS on-state current (IT(RMS)) of 16 A and a non-repetitive peak off-state voltage (VDSM/VRSM) of 900 V. The device supports three triggering quadrants with a gate trigger current (IGT) max of 35 mA and a static dV/dt immunity min of 2000 V/µs at Tj = 150 °C. Thermal resistance from junction to case (Rth(j-c)) is max 1.1 °C/W.
Verify the specific ordering suffix when sourcing components. The base part number T1635H-8G is available in tube packaging with a base quantity of 50 units. The variant ending in -TR utilizes tape and reel delivery with a base quantity of 1000 units. Confirm the required packing mode matches the assembly equipment specifications before finalizing procurement orders.
Select this component for applications requiring compact drive solutions for heavy AC loads where heatsink size reduction is critical. The device is suitable for controlling universal motors, heaters, and inductive loads in industrial and home appliance environments. Ensure the design accommodates the 150 °C maximum junction temperature rating and verify thermal management requirements against the provided junction-to-ambient resistance curves.
This Triac belongs to the H-Series family characterized by high noise immunity and robust dynamic turn-off commutation capabilities. The series includes variants in different packages, such as the TO-220AB Insulated version which provides internal ceramic pad insulation rated at 2500 V RMS. The D²PAK package offers enhanced thermal management compared to traditional through-hole options.
The T1635H-8I serves as a pin-compatible alternative within the same series but utilizes a TO-220AB Insulated package instead of the D²PAK form factor. Designers must account for the physical footprint differences and the additional electrical isolation properties provided by the internal ceramic pad in the TO-220AB variant.
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