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T1M-20-GF-DH is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is DISCRETE WIRE TERMINAL STRIP, 1.. Review the specifications below when checking this part for your BOM.
The T1M-20-GF-DH is a discrete wire terminal strip header manufactured by Samtec Inc. It features a 1.00mm (0.039 inch) pitch with 40 positions arranged in a double-row configuration. Designed for surface mount installation, this right-angle connector utilizes phosphor bronze contacts with gold plating and liquid crystal polymer insulation rated UL94 V-0. The component supports board-to-cable applications with a current rating of 3.3A per contact and operates within a temperature range of -55°C to +125°C.
Verify the specific suffix 'DH' confirms the right-angle orientation and double-row structure before ordering. Confirm that the gold finish thickness meets the required corrosion resistance standards for the target environment. Ensure the PCB footprint matches the specified row spacing and pin layout to prevent soldering defects during surface mount processing.
Select this model when a right-angle profile is necessary to clear adjacent components or facilitate cable routing direction. The double-row format provides higher density compared to single-row alternatives while maintaining the standard 1.00mm pitch. Consider the locking ramp feature if vibration resistance is critical for the application environment.
This component belongs to the Micro Mate™ T1M series, which specializes in 1.00mm pitch headers. The series offers both vertical and right-angle options across various position counts. The T1M-20-GF-DH specifically addresses needs for shrouded box headers requiring secure latching and high-temperature performance in space-constrained designs.
Compatible substitutes include other Samtec T1M series headers with identical pitch and row count but different orientations, such as T1M-20-GF-S-V-K for vertical mounting. Cross-reference physical dimensions and electrical ratings to ensure functional equivalence without modifying the PCB layout.
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