SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The T2535T-8I is a 25 A, 800 V Triac in an insulated TO-220AB package. It supports on/off or phase angle control for general purpose AC switching. The device features ST Snubberless technology, offering high noise immunity and robust dynamic turn-off commutation up to 150 °C junction temperature. Key electrical parameters include a maximum gate trigger current (IGT) of 35 mA, a non-repetitive surge peak on-state current (ITSM) of 210 A at 16.7 ms, and a critical rate of rise of on-state current ((dI/dt)c) of 100 A/µs. The package provides UL recognized component isolation rated at 2500 VRMS.
Verify the specific ordering code T2535T-8I against the manufacturer's latest datasheet DS13445 before procurement. Confirm that the TO-220AB Insulated package variant matches the design requirement for 2.5 kV isolation. Check for any product change notifications or revision updates that may affect mechanical dimensions or electrical characteristics prior to finalizing orders.
Select this component when high commutation capability and insulation are required in constrained home appliance environments. Ensure the application respects the 150 °C maximum junction temperature limit and the 35 mA maximum gate trigger current. Verify that the load current does not exceed the 25 A RMS rating at the expected case temperature of 101 °C. Consider the thermal resistance values for adequate heat sinking design.
The T2535T-8I belongs to the T-series Triacs from STMicroelectronics, designed for medium current AC switching applications. It is part of the ECOPACK2 compliant family, ensuring environmental compliance. The 'I' suffix denotes the TO-220AB insulated package variant, distinguishing it from standard or surface-mount versions within the same electrical specification family.
Direct substitutes within the same series include T2535T-8T (standard TO-220AB) and T2535T-8G (D2PAK). For insulated requirements, consider T1625T-8I which offers similar insulation but lower current ratings. Verify pinout compatibility and thermal performance when swapping between package types.