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The T405-600B is a three-terminal logic-level triac manufactured by STMicroelectronics, designed for general-purpose AC inductive load control. It operates within a repetitive peak off-state voltage range of 600 V and supports an RMS on-state current of 4 A. The device features a sensitive gate with a maximum trigger current of 5 mA and a maximum trigger voltage of 1.3 V, enabling direct interface with microcontrollers. It is housed in a surface-mount TO-252 (DPAK) package with three pins. The component withstands a non-repetitive surge current of 30 A at 50 Hz and maintains a holding current of 10 mA. Operating temperatures span from -40°C to +125°C junction temperature.
Verify the specific ordering suffix to confirm packaging format, as standard tape-and-reel variants exist alongside other configurations. Confirm RoHS compliance status and lead times directly with authorized distributors prior to finalizing procurement plans. Ensure the selected variant matches the required thermal and electrical specifications for the target application environment.
Select this component when designing circuits requiring direct MCU gate drive without additional buffering stages. The 4 A rating suits moderate power applications, while the 600 V blocking voltage handles standard mains voltages. Consider the DPAK package for space-constrained PCB layouts where surface mount assembly is preferred over through-hole alternatives.
This device belongs to the T4 series of logic-level triacs from STMicroelectronics. The series utilizes proprietary Snubberless technology to optimize commutation performance. Other members in this family include variants with different voltage ratings such as 800 V models, offering flexibility for various industrial and consumer electronics designs requiring reliable AC switching capabilities.
The T405Q-600B-TR serves as a verified alternative within the same product line. Both devices share identical electrical characteristics including 4 A current handling and 600 V voltage ratings. Verify pinout compatibility and thermal resistance values before substituting to ensure seamless integration into existing board designs.