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The T405Q-600H is a logic-level sensitive gate triac manufactured by STMicroelectronics, designed for general-purpose AC switching applications requiring high surge current capability. It operates with an RMS on-state current of 4 A and supports a rated repetitive peak off-state voltage (VDRM) of 600 V. The device features a non-repetitive peak on-state current of 38 A and maintains a low holding current maximum of 10 mA. Gate triggering requirements are specified with a maximum voltage of 1.5 V and current of 10 mA. It exhibits an on-state voltage of 1.5 V and a maximum off-state leakage current of 5 uA at VDRM. The component functions within a junction temperature range of -40°C to +125°C and is housed in an IPAK through-hole package.
Verify the specific suffix H indicates the IPAK through-hole package configuration distinct from surface mount variants like the B-TR series. Confirm RoHS compliance status and manufacturing origin details against the latest official datasheet revision. Ensure ordering quantities align with standard tube packaging specifications provided by authorized distributors.
Select this component when designing circuits that require direct MCU interface due to its low gate trigger current sensitivity. The 600 V rating suits standard AC line voltage applications, while the 4 A RMS current capacity supports moderate load requirements. Consider the IPAK package for through-hole assembly processes where higher thermal mass or mechanical robustness is preferred over surface mount options.
The T405Q-600H belongs to the T405 series of four-quadrant sensitive gate triacs from STMicroelectronics. This family utilizes Snubberless technology to simplify circuit design by eliminating external snubber networks typically required for inductive loads. The series offers various voltage ratings and package options to accommodate diverse industrial and consumer appliance requirements.
The T405Q-600B-TR serves as a functional equivalent within the same series but utilizes a DPAK surface-mount package instead of the IPAK through-hole form factor. Verify pinout compatibility and thermal management requirements when substituting between these package types.