T55F484C4

Field Programmable Gate Array Overview

The Efinix T55F484C4 is a Titanium series Field Programmable Gate Array (FPGA) designed for high-performance embedded applications. It features 92,534 logic units and 6,880,000 total RAM bits within a 484-LFBGA package. The device operates on a supply voltage range of 0.92V to 0.98V and supports a junction temperature range of 0°C to 85°C. Key specifications include 80 general-purpose I/Os and 336 DSP blocks. This component is part of the Titanium family, offering enhanced LPDDR4/4x controller capabilities and MIPI D-PHY interfaces for high-speed data connectivity in compact form factors.

Field Programmable Gate Array Feature Summary

• Enhanced LPDDR4/4x memory controller integration for efficient external frame buffering
• Integrated MIPI D-PHY interface supporting high-speed serial communication up to 2.5 Gbps per channel
• High-density logic architecture with significant DSP block allocation for signal processing tasks

Field Programmable Gate Array Applications

• Video capture and processing systems requiring low power consumption
• Sensor data aggregation for IoT and mobile applications
• Industrial automation using FPGA-based control logic

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'C4' against official Efinix documentation to confirm the presence of the enhanced LPDDR4 controller block, as this variant distinguishes itself from other Ti55 packages. Ensure compatibility with the Efinity software suite for bitstream generation. Confirm moisture sensitivity level (MSL 3) handling requirements during storage and assembly to prevent package damage. Cross-reference the RoHS3 compliance status with current environmental regulations before finalizing procurement orders.

Field Programmable Gate Array Selection Notes

Select the T55F484C4 when design requirements demand a balance between moderate logic density and high-speed peripheral connectivity. This model is suitable for applications needing integrated memory controllers without external PHY complexity. Compare resource utilization against the TI90J484C3 if higher DSP counts are unnecessary. Validate that the 484-ball BGA footprint fits the target PCB constraints and thermal management strategy for the specified operating temperature range.