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T55F576C3 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is IC FPGA 278 I/O 576FBGA. Review the specifications below when checking this part for your BOM.
The T55F576C3 is a Field Programmable Gate Array (FPGA) from the Efinix Trion series, designed for high-density logic applications. It features 55,000 logic elements and operates within a supply voltage range of 1.14V to 1.26V for the core. The device supports maximum data rates of 622 Mbps for serial transceivers and includes embedded memory blocks totaling 2.8 Mbits. It utilizes a 0.13-micron CMOS process technology and is available in a 576-pin FineLine BGA package with a 1.0 mm pitch. The component supports industrial temperature ranges and integrates dedicated DSP slices for arithmetic operations.
Verify the specific suffix codes on the component marking against official Efinix documentation to confirm package variant and temperature grade. Ensure that any ordering information references the complete part number including tape and reel specifications if applicable. Cross-reference the manufacturer's latest datasheet to confirm current production status and recommended operating conditions prior to integration into design files.
Select this model when design requirements exceed the capacity of smaller Trion variants but do not necessitate the higher density of Titan series devices. Evaluate pin count constraints against the 576-ball BGA footprint availability in your assembly process. Confirm that the required I/O voltage levels are compatible with the supported bank configurations and that the thermal dissipation characteristics of the package meet your enclosure design limits.
This component belongs to the Efinix Trion FPGA family, which targets cost-sensitive applications requiring moderate logic density and low power consumption. The Trion series bridges the gap between complex CPLDs and high-end FPGAs, offering a balance of performance and resource efficiency. It is commonly used in designs where programmability is needed without the overhead of larger architectures.
Direct replacements within the same package and pinout may include other Trion series parts with higher or lower logic densities, such as the T75 or T35 variants, provided the functional requirements align. Verify compatibility with existing bitstream tools and ensure that pin assignments remain unchanged if swapping within the family.
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