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TA-25.000MBD-T is listed in the Oscillators range at ChipApex. The manufacturer field lists TXC CORPORATION. Its product description is MEMS OSC XO 25.0000MHZ CMOS SMD. Review the specifications below when checking this part for your BOM.
The TA-25.000MBD-T is a MEMS-based standard clock oscillator manufactured by TXC Corporation, operating at a frequency of 25 MHz with CMOS output signals. It functions on a 3.3V supply voltage and features an enable/disable control function for power management. The device offers a frequency stability of ±25ppm and operates within a temperature range of -40°C to +85°C. Packaged in a compact 4-SMD, no-lead surface mount format measuring 2.50mm x 2.00mm x 0.80mm, it supports reflow soldering processes suitable for automated assembly lines.
Verify the specific ordering suffix against the manufacturer's official part number guide to ensure correct pinout and electrical specifications. Confirm that the component meets RoHS3 compliance requirements for your region. Check current availability status as production lifecycle changes may affect lead times. Ensure compatibility with existing PCB footprint dimensions before finalizing procurement decisions.
Select this component when a small form factor MEMS oscillator is required for space-constrained designs. Consider the ±25ppm stability specification against application timing tolerance requirements. Evaluate the 3.3V supply constraint against available board voltages. The enable/disable feature makes it suitable for battery-powered applications requiring active power management strategies during idle states.
This part belongs to the TA series of MEMS oscillators from TXC Corporation, designed as modern replacements for traditional quartz crystals. The series emphasizes miniaturization and reliability through silicon-based resonator technology. It fits into the broader category of surface-mount timing devices used across various electronic industries demanding high precision and durability.
The TD-25.000MBD-T is documented as a related variant within the same manufacturer portfolio. Verify pin-to-pin compatibility and electrical parameter alignment before substitution. Cross-reference datasheets to confirm identical package dimensions and thermal characteristics.
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