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The TAS5112DFD is a stereo digital amplifier power stage from Texas Instruments, part of the PurePath Digital series. It operates on a supply voltage range of 16V to 25.5V and delivers up to 62W per channel into a 6-ohm load. The device utilizes a 56-PowerTSSOP (0.240 inch, 6.10mm wide) package with surface mount installation. It supports digital inputs and includes integrated protection features such as pop-and-click suppression, mute, shutdown, short-circuit, and thermal protection. The component functions within an ambient temperature range of 0°C to 70°C.
Verify the exact suffix designation when sourcing replacements, as variations like DFDR or G4 may indicate specific tape-and-reel packaging or RoHS compliance levels. Confirm that the base model number matches the required pinout and electrical specifications for your design. Check current availability status as older revisions may be discontinued by distributors. Ensure the replacement component meets the same thermal and voltage requirements for your specific application environment.
Select this component for applications requiring high-power stereo amplification driven directly by digital signals. Consider the 56-pin PowerTSSOP package for its thermal performance and space efficiency in dense layouts. Evaluate the 16V to 25.5V supply range against your system's power architecture. Verify that the integrated protections align with your safety and reliability standards for consumer electronics.
The TAS5112 belongs to Texas Instruments' PurePath Digital family of audio solutions. This series focuses on integrating digital processing with power amplification to reduce external component count. The device is designed for high-fidelity audio reproduction in compact form factors, leveraging advanced Class D technology for efficiency.
Direct substitutes include TAS5112ADFDR and TAS5112DFDR. These alternatives share the same core functionality and pinout compatibility. Verify package dimensions and thermal characteristics before finalizing any substitution to ensure mechanical fit and adequate heat dissipation in the target enclosure.