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The TAS5162DDV is a high-performance stereo digital amplifier power stage from Texas Instruments, housed in a 44-pin HTSSOP PowerPad package. It delivers up to 210 W per channel into a 6-ohm BTL load at 10% THD+N and 300 W into a 4-ohm PBTL load. The device operates with a 50 V PVDD supply and 12 V GVDD/VDD supplies, achieving over 90% efficiency via 80-mΩ output MOSFETs. Audio specifications include an SNR exceeding 110 dB (A-weighted) and total harmonic distortion plus noise below 0.09% at 1 W.
Verify the specific ordering suffix DDV corresponds to the 44-pin HTSSOP PowerPad package configuration. Confirm compatibility with PurePath Digital chipsets such as the TAS5508 or TAS5518 modulators for proper system integration. Ensure thermal interface design accounts for the smaller pad area relative to alternative packages to maintain adequate heat dissipation.
Select this component when designing high-fidelity audio systems requiring significant power output within a compact form factor. The DDV package offers a thermally enhanced solution suitable for applications where efficient heat transfer to a heatsink is critical. Consider the internal power-on reset feature if complex power-supply sequencing cannot be implemented in the host system design.
This device belongs to the Texas Instruments PurePath Digital family of Class-D amplifier power stages. It is designed to work in conjunction with TI PWM processors to create complete digital audio amplification solutions. The TAS5162DDV variant specifically utilizes the 44-pin HTSSOP PowerPad package, which provides a distinct thermal footprint compared to the 36-pin PSOP3 option.
The TAS5162DKD serves as a pin-compatible alternative offering identical electrical performance but utilizing a 36-pin PSOP3 package with a larger thermal pad area. Designers should evaluate thermal management requirements when substituting between these package types.
No, the device includes an internal power-on reset circuit that eliminates the need for complex power-supply sequencing during startup.
The DDV package has a smaller pad area than the DKD package, making the thermal interface resistance to the heatsink more critical for maintaining optimal junction temperatures.