TB62208FG,8,EL

Overview

The TB62208FG,8,EL is a bipolar stepper motor driver IC from Toshiba Semiconductor and Storage. It integrates control logic and power stages in a 28-HSOP package. The device supports a supply voltage of 4.5V to 5.5V and handles load voltages from 10V to 38V. It delivers an output current of 1.8A per channel with four half-bridge outputs. Operating temperature ranges from -20°C to 150°C junction temperature. Features include UVLO, ISD, and TSD protection.

Feature Summary

• Fully integrated driver combining control logic and DMOS power stage
• Supports 1-step and 1/2-step resolution for bipolar motors
• Includes under-voltage lockout, over-current shutdown, and thermal shutdown

Applications

• General purpose bipolar stepper motor control
• Office automation equipment
• Industrial control systems

Procurement Notes

Verify component authenticity as the part status is obsolete. Confirm package integrity upon receipt. Check datasheet revisions for any functional updates. Ensure storage conditions meet moisture sensitivity level requirements. Validate pin compatibility before integration into existing designs.

Selection Notes

Select this component for applications requiring integrated bipolar stepper motor driving with moderate current needs. Consider the 28-HSOP package constraints for PCB layout. Evaluate thermal management capabilities given the operating temperature range. Verify that the 1.8A output current meets load requirements without external cooling.

Part Context

This part belongs to the TB62208 series of stepping motor drivers. It is designed for general-purpose applications requiring reliable bipolar motor control. The series offers integrated solutions reducing external component count. Toshiba provides documentation detailing electrical characteristics and application circuits for design reference.

Replacement Considerations

TB67S213FTAG,EL is listed as a parameter-equivalent substitute. Verify pinout compatibility and electrical specifications before substitution. Confirm package dimensions match the existing footprint. Review datasheets for both parts to ensure functional equivalence in the target application.