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The TB67S109AFNG,EL is a bipolar stepper motor driver IC manufactured by Toshiba Semiconductor and Storage. It utilizes BiCD technology to integrate power MOSFETs and control logic on a single chip. The device supports clock input control with resolution options ranging from full step to 1/32 microstep. It features PWM constant current drive with Advanced Dynamic Mixed Decay (ADMD) for high-speed performance. Key electrical specifications include a supply voltage range of 4.75V to 5.25V for VCC and 10V to 47V for VM. The output configuration consists of four half-bridges capable of driving one bipolar stepper motor. The package is a 48-pin HTSSOP with an exposed pad.
Verify the specific suffix EL indicates tape and reel packaging when ordering. Confirm the manufacturer is Toshiba Semiconductor and Storage. Ensure the part number matches the exact HTSSOP-48-EP variant. Check RoHS compliance status if required for your assembly process. Validate lead times as they may vary based on production schedules.
Select this component when a single-chip solution for bipolar stepper motors is required. It is suitable for applications needing up to 1/32 microstepping resolution. Consider its integrated current sensing which eliminates external sense resistors. Evaluate its thermal performance given the 48-pin HTSSOP package. Ensure the system voltage aligns with the specified VM and VCC ranges.
This part belongs to the TB67S109A family of stepper motor drivers. The AFNG suffix denotes the HTSSOP-48 package type. The EL suffix typically indicates tape and reel packaging for automated assembly. It is designed as a replacement or upgrade for older discrete driver solutions. The family shares core functionality with variants like the AFTG QFN package.
Direct pin-to-pin replacements within the same package require checking equivalent current ratings and decay modes. Compare ADMD capabilities against legacy drivers to ensure similar high-speed performance. Verify that the new driver supports the required microstep resolution. Ensure thermal characteristics match the existing PCB layout constraints.