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TBD62308AFAG,EL
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Product Detailed Parameters
- Description：IC PWR SWITCH N-CHAN 1:1 24SSOP
- Series：-
- Mfr：Toshiba Semiconductor and Storage
- Package：Tape & Reel (TR),Cut Tape (CT)
- Switch Type：General Purpose
- Number of Outputs：4
- Ratio - Input:Output：1:01
- Output Configuration：Low Side
- Output Type：N-Channel
- Interface：On/Off
- Voltage - Load：50V (Max)
- Voltage - Supply (Vcc/Vdd)：4.5V ~ 5.5V
- Current - Output (Max)：1.5A
- Rds On (Typ)：370mOhm
- Input Type：Inverting
- Features：-
- Fault Protection：-
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Supplier Device Package：24-SSOP
- Package / Case：24-SOP (0.236", 6.00mm Width)
- Grade：-
- Qualification：-
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Overview
The TBD62308AFAG,EL is a low-side DMOS transistor array manufactured by Toshiba Semiconductor and Storage. It integrates four independent N-channel drivers in a 24-SSOP surface-mount package. The device supports a load voltage up to 50V and delivers a maximum output current of 1.5A per channel. It operates within a supply voltage range of 4.5V to 5.5V and features an inverting input configuration. The component functions across a temperature range of -40°C to +85°C with a typical on-resistance of 370 milliohms.
Feature Summary
- Integrates four independent low-side N-channel power switches for simultaneous control
- Utilizes DMOS technology to achieve high current handling capability per channel
- Features an inverting logic interface for direct compatibility with standard digital controllers
Applications
- Driving DC motors in industrial automation systems
- Controlling solenoid valves in fluid management equipment
- Power switching for lighting arrays in automotive or consumer applications
Procurement Notes
Verify the specific suffix EL against the manufacturer's datasheet to confirm the tape-and-reel packaging format and compliance status. Ensure the 24-SSOP footprint matches the PCB design constraints. Confirm RoHS3 compliance requirements align with project specifications before finalizing procurement orders.
Selection Notes
Select this component when four independent low-side channels are required with high current capacity. The 24-SSOP package offers a compact solution for space-constrained designs compared to DIP alternatives. Consider thermal dissipation requirements due to the 370 milliohm on-resistance under heavy load conditions.
Part Context
This part belongs to the TBD62308 series of DMOS transistor arrays. Variants such as TBD62308AFG,EL utilize a 16-pin HSOP package, while TBD62308APG,HZ uses a 16-pin DIP. The AFAG variant specifically provides expanded pin count in a 24-SSOP form factor for enhanced connectivity options.
Replacement Considerations
TBD62308AFG,EL serves as a package-compatible alternative if a 16-pin HSOP footprint is acceptable instead of the 24-SSOP. Verify pinout compatibility carefully as pin assignments may differ between package types within the same functional family.
