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Product Detailed Parameters
- Description:IC PWR DRIVER N-CHAN 1:1 20SSOP
- Series:-
- Mfr:Toshiba Semiconductor and Storage
- Package:Tape & Reel (TR),Cut Tape (CT)
- Switch Type:General Purpose
- Number of Outputs:8
- Ratio - Input:Output:1:01
- Output Configuration:Low Side
- Output Type:N-Channel
- Interface:On/Off
- Voltage - Load:0V ~ 50V
- Voltage - Supply (Vcc/Vdd):4.5V ~ 5.5V
- Current - Output (Max):500mA
- Rds On (Typ):1.5Ohm
- Input Type:Inverting
- Features:-
- Fault Protection:-
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Supplier Device Package:20-SSOP
- Package / Case:20-LSSOP (0.173", 4.40mm Width)
- Grade:-
- Qualification:-
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Overview
The Toshiba TBD62387AFNG,EL is an eight-channel low-side DMOS transistor array gate driver designed for switching loads. It operates with a supply voltage range of 4.5 V to 5.5 V and supports load voltages up to 50 V. Each channel provides a maximum output current of 500 mA with an on-resistance of 1.5 Ohms. The device features inverting logic control and utilizes CMOS input technology. It is housed in an 18-pin SSOP surface-mount package and functions within a temperature range of -40°C to +85°C.
Feature Summary
- Integrates eight independent low-side N-channel DMOS outputs for high-current load driving
- Features inverting logic interface compatible with standard CMOS inputs
- Provides robust switching capability with 500 mA per channel output capacity
Applications
- General-purpose load switching circuits
- Relay and solenoid drive applications
- Motor control systems requiring low-side switching
Procurement Notes
Verify the specific suffix EL indicates tape and reel packaging when ordering. Confirm the SSOP-18 footprint matches the target PCB layout. Ensure the operating environment remains within the specified -40°C to +85°C thermal limits. Cross-reference the datasheet for absolute maximum ratings to prevent overvoltage conditions during system integration.
Selection Notes
Select this component for designs requiring multiple synchronized low-side switches with moderate current demands. The inverting configuration simplifies logic interfacing where active-low control signals are preferred. Consider the thermal dissipation capabilities of the SSOP package relative to the total number of active channels under continuous load conditions.
Part Context
This part belongs to Toshiba's TBD6238x series of DMOS transistor arrays. It shares functional similarities with other members like the TBD62381 and TBD62384 but differs in package type and pinout configuration. The AFNG,EL variant specifically denotes the surface-mount SSOP form factor, distinguishing it from through-hole DIP alternatives within the same product family.
Replacement Considerations
TBD62381AFNG,EL offers identical electrical specifications in the same SSOP-18 package. TBD62387APG provides the same functionality in a through-hole DIP-20 package. Verify pin compatibility before substituting across different package types.
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