— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC PWR SWITCH N-CHAN 1:1 16SOP
- Series:-
- Mfr:Toshiba Semiconductor and Storage
- Package:Tape & Reel (TR),Cut Tape (CT)
- Switch Type:General Purpose
- Number of Outputs:7
- Ratio - Input:Output:1:01
- Output Configuration:Low Side
- Output Type:N-Channel
- Interface:On/Off
- Voltage - Load:50V (Max)
- Voltage - Supply (Vcc/Vdd):Not Required
- Current - Output (Max):300mA
- Rds On (Typ):-
- Input Type:Inverting
- Features:-
- Fault Protection:-
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:16-SOP
- Package / Case:16-SOIC (0.173", 4.40mm Width)
- Grade:-
- Qualification:-
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Overview
The Toshiba TBD62502AFG,EL is a monolithic integrated circuit designed for driving inductive loads such as relays and solenoids. It integrates high-voltage NPN Darlington transistors with built-in flyback diodes to protect against voltage spikes generated during switching operations. The device features a compact surface-mount package suitable for space-constrained applications. Key electrical characteristics include a collector-emitter saturation voltage of approximately 1.3V at specified currents and a continuous collector current rating per channel. The input logic is compatible with standard TTL and CMOS levels, allowing direct interfacing with microcontrollers or logic gates without additional level-shifting components.
Feature Summary
- Integrated flyback diodes eliminate the need for external protection components
- Direct interface capability with standard digital logic families
- High voltage tolerance for driving inductive load types
Applications
- Industrial control systems requiring relay actuation
- Automotive electronic modules for solenoid control
- Home appliance driver circuits for motor or valve operation
Procurement Notes
Verify the exact suffix EL indicates the specific tape and reel packaging configuration required for automated assembly processes. Confirm that the operating temperature range meets the environmental specifications of the final product design. Ensure compatibility with the intended PCB footprint and soldering profile standards before placing orders.
Selection Notes
Evaluate the total power dissipation capabilities relative to the thermal resistance of the chosen package type. Consider the number of channels required versus available pins to optimize board space. Assess the input current requirements to ensure the driving source can supply sufficient current without exceeding its own limits.
Part Context
This component belongs to Toshiba's series of high-voltage Darlington array ICs. These devices are engineered for robustness in noisy environments common in industrial and automotive settings. The monolithic construction ensures consistent performance across all channels within the single package.
Replacement Considerations
Check for pin-compatible alternatives from other manufacturers offering similar Darlington configurations. Verify that substitute parts maintain equivalent voltage ratings and current handling capabilities. Ensure any replacement includes integrated flyback diodes if external components cannot be added.
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