TBD62502APG

Overview

The TBD62502APG is a low-side DMOS transistor array manufactured by Toshiba Semiconductor and Storage. It integrates seven independent N-channel driver channels within a single integrated circuit. The device supports a maximum load voltage of 50V and provides an output current capability of 300mA per channel. It operates with an inverting logic configuration, meaning the outputs activate when inputs are low. The component functions within a supply voltage range of 14V to 25V and is rated for an ambient operating temperature between -40°C and +85°C. It is housed in a 16-pin DIP package designed for through-hole mounting.

Feature Summary

• Integrates seven independent low-side N-channel DMOS drivers for simultaneous load control
• Features inverting logic configuration for direct interface with standard digital logic
• Provides robust 50V load voltage tolerance with 300mA continuous output current per channel

Applications

• Driving multiple solenoids or valves in industrial automation systems
• Contacting lamps or heaters in home appliance control circuits
• Actuating relays or small motors in general-purpose switching applications

Procurement Notes

Verify the specific suffix APG confirms the 16-DIP through-hole package variant rather than SOP or SSOP surface-mount versions. Confirm RoHS compliance status via official datasheets as manufacturing processes may vary. Ensure input logic levels match the specified 14V to 25V supply range requirements for reliable operation.

Selection Notes

Select this component when seven isolated low-side switches are required in a single package. It is suitable for applications needing moderate current handling up to 300mA per channel. Consider thermal dissipation capabilities if driving loads near the maximum current rating continuously. Verify that the inverting logic aligns with the system control architecture.

Part Context

This part belongs to the TBD62502 series of DMOS transistor arrays from Toshiba. The series offers various packaging options including SOP and SSOP, but the APG suffix specifically denotes the dual in-line package form factor. These devices are commonly used in power management IC applications requiring multi-channel switching capabilities.

Replacement Considerations

TBD62502AFNG,EL (SSOP package), TBD62502AFG,EL (SOP package). Note that these substitutes share identical electrical characteristics but differ in physical footprint and mounting style.