TBD62781AFWG,EL

Overview

The Toshiba TBD62781AFWG,EL is an eight-channel high-side DMOS transistor array gate driver designed for surface-mount applications. It operates within a supply voltage range of 2 V to 50 V and delivers up to 500 mA output current per channel. The device features non-inverting logic configuration and is housed in a PSOP-18 package. It supports a power dissipation of 1.31 W and functions reliably across an operating temperature range from -40°C to +85°C.

Feature Summary

• Integrates eight independent high-side DMOS outputs for simultaneous load control
• Supports wide input supply voltage operation from 2 V to 50 V
• Provides robust 500 mA drive capability per channel for heavy loads
• Features non-inverting logic interface for direct signal compatibility

Applications

• Automotive lighting systems requiring high-side switching
• Industrial motor control circuits utilizing DMOS arrays
• General-purpose load drivers in embedded systems
• Relay and solenoid driving applications

Procurement Notes

Verify the specific suffix 'AFWG,EL' against the official Toshiba datasheet to confirm the PSOP-18 package and reel packaging specifications. Ensure the procurement order matches the required tape-and-reel quantity increments. Cross-reference the RoHS compliance status with the latest manufacturer documentation before finalizing purchase orders.

Selection Notes

Select this component when an eight-channel high-side driver is required with a 50 V maximum rating. The PSOP-18 surface-mount package suits space-constrained PCB designs. Verify that the 500 mA per-channel current capacity meets the load requirements. Confirm that the 2 V minimum logic threshold aligns with the system's microcontroller or controller output levels.

Part Context

This part belongs to the Toshiba TBD6278x series of DMOS transistor arrays. It serves as a surface-mount alternative to through-hole DIP variants like the TBD62781APG. The series provides integrated high-side switching solutions for automotive and industrial applications, consolidating multiple discrete transistors into a single compact IC package.

Replacement Considerations

The TBD62781APG offers identical electrical characteristics but utilizes a PDIP-18 through-hole package. Substitution requires evaluating PCB layout constraints and mounting technology differences between surface-mount and through-hole implementations.