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TBD62783AFNG,EL
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Product Detailed Parameters
- Description：IC PWR SWITCH P-CHAN 1:1 18SSOP
- Series：-
- Mfr：Toshiba Semiconductor and Storage
- Package：Tape & Reel (TR),Cut Tape (CT)
- Switch Type：General Purpose
- Number of Outputs：8
- Ratio - Input:Output：1:01
- Output Configuration：High Side
- Output Type：P-Channel
- Interface：On/Off
- Voltage - Load：50V (Max)
- Voltage - Supply (Vcc/Vdd)：Not Required
- Current - Output (Max)：500mA
- Rds On (Typ)：-
- Input Type：Non-Inverting
- Features：-
- Fault Protection：-
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Supplier Device Package：18-SSOP
- Package / Case：18-LSSOP (0.173", 4.40mm Width)
- Grade：-
- Qualification：-
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Overview
The TBD62783AFNG,EL is an eight-channel high-side power switch and driver IC manufactured by Toshiba Semiconductor and Storage. It utilizes DMOS transistor technology to provide independent control for each channel with a 1:1 input-to-output ratio. The device supports a maximum load voltage of 50V and delivers a continuous output current of 500mA per channel. It operates within an ambient temperature range of -40°C to +85°C and features non-inverting logic inputs. The component is housed in an 18-SSOP surface-mount package.
Feature Summary
- Integrates eight independent high-side switches with individual control inputs
- Utilizes DMOS technology for robust power switching capabilities
- Features non-inverting logic interface for direct signal compatibility
Applications
- Industrial automation control systems
- PLC I/O modules
- General-purpose load driving applications
Procurement Notes
Verify the specific suffix 'FNG' against the manufacturer datasheet to confirm the exact pinout and package dimensions, as variations exist within the TBD62783 family. Ensure the application environment remains within the specified -40°C to +85°C operating temperature range to maintain reliability. Confirm that the required load current does not exceed the 500mA per channel limit under expected thermal conditions.
Selection Notes
Select this component when eight independent high-side switching channels are required in a compact surface-mount form factor. It is suitable for applications needing 50V load handling and 500mA per channel capacity. Consider the 18-SSOP package constraints during PCB layout. Verify that the control signals align with the non-inverting logic configuration before finalizing the design.
Part Context
This part belongs to the TBD62783 series of power switches designed for industrial and automotive environments. The series offers various packaging options including SSOP and SOP formats. The AFNG variant specifically denotes the 18-SSOP package configuration. This series is commonly used in PLCs and relay drivers where multiple isolated outputs are necessary.
Replacement Considerations
Check the TBD62783A(P,F,FN,FW)G datasheet for alternative package variants such as FW or FN which may share identical electrical characteristics but differ in physical footprint.
