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The TC0326A is a surface-mount SAW resonator manufactured by TST, operating at a center frequency of 868.98 MHz with a nominal impedance of 50 Ohms. Designed for robust performance in demanding environments, it supports a wide operating temperature range from -40°C to +85°C. The component utilizes a compact 6-SMD, no-lead package configuration, specifically the SM3030-6PAD footprint, facilitating efficient integration into space-constrained circuit boards. It functions as a single-port resonator suitable for high-frequency signal generation and filtering applications within wireless communication systems.
Verify the specific suffix codes against the manufacturer's latest datasheet to ensure correct packaging options such as cut tape or reel quantities. Confirm that the required tolerance and load capacitance specifications align with the target oscillator circuit design before finalizing procurement orders to avoid functional mismatches.
Select this component when a fixed-frequency reference is required for ISM band applications around 869 MHz. Ensure the host circuit can accommodate the 50 Ohm impedance without additional matching networks. Consider the thermal environment; while rated to 85°C, verify that peak junction temperatures during operation remain within safe limits for long-term reliability.
This device belongs to the TC series of SAW resonators from TAI-SAW TECHNOLOGY (TST). These components are engineered for wireless connectivity solutions, providing reliable frequency stability compared to ceramic resonators. The series is widely utilized in consumer electronics and industrial IoT devices where size constraints and temperature resilience are critical design factors.
Direct substitutes must match the 868.98 MHz frequency, 50 Ohm impedance, and SM3030-6PAD package dimensions. Verify equivalent temperature ranges and maximum input power ratings (typically 0 dBm) to ensure circuit compatibility. Cross-reference with other manufacturers' ISM band SAW resonators only after confirming pinout and mechanical footprint equivalence.