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The TC1303B-ZI0EMF is a dual-output power management integrated circuit manufactured by Microchip Technology. It integrates a 500 mA synchronous buck regulator and a 300 mA low-dropout (LDO) linear regulator within a single 10-lead DFN package measuring 3 x 3 mm with a height of 0.9 mm. The device operates from an input voltage range of 2.7 V to 5.5 V, with a nominal rating of 3.6 V. The switching regulator utilizes current-mode control with pulse width modulation at a fixed frequency of 2.0 MHz under heavy loads, transitioning automatically to pulse frequency modulation for improved light-load efficiency. Both outputs are internally compensated.
Verify the specific suffix code against official Microchip documentation to confirm the exact output voltage configuration, as variations exist within the TC1303B family. Ensure compatibility with RoHS and REACH standards if required by your manufacturing process. Confirm the package type matches your PCB footprint requirements before finalizing procurement orders.
Select this component when a compact solution is needed to generate two distinct voltage rails from a single input source. The internal compensation simplifies design implementation by reducing external component count. Consider the thermal performance of the exposed pad in the DFN package for adequate heat dissipation during continuous operation at maximum load currents.
This part belongs to the TC1303 series, which features integrated power management solutions designed for space-constrained applications. The series includes variants with different fixed output voltages and adjustable options. The TC1303B designation specifically indicates the version with independent shutdown controls for the buck and LDO sections, offering greater flexibility in power sequencing and management strategies.
Direct substitutes include other TC1303B variants with matching output configurations, such as TC1303B-SA0EMFTR. Verify that any replacement maintains the same pinout and electrical characteristics to ensure board-level compatibility without redesign.