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TC3-1T+ is listed in the Balun range at ChipApex. The manufacturer field lists Mini-Circuits. Its product description is 1:3 CORE & WIRE TRANSFORMER, 5 -. Review the specifications below when checking this part for your BOM.
The TC3-1T+ is a surface-mount audio and signal transformer manufactured by Mini-Circuits. It operates as a 1:3 balun within a frequency range of 5 MHz to 300 MHz. The component utilizes a core and wire construction with a 50-ohm impedance configuration. It is housed in a compact 5-SMD module package designed for automated assembly processes. The device supports single-channel operation and complies with RoHS standards for environmental safety.
Verify the specific ordering suffix against official Mini-Circuits documentation to ensure correct variant selection. Confirm that the requested quantity aligns with standard factory packaging configurations. Check current availability status through authorized distributors, as lead times may vary based on production cycles. Ensure compatibility with existing PCB footprint requirements before finalizing procurement orders.
Select this component when a 1:3 impedance transformation ratio is required between 5 MHz and 300 MHz. Consider the 5-SMD package dimensions for space-constrained board layouts. Evaluate the 50-ohm system impedance match against source and load characteristics. Verify thermal operating limits against the intended application environment to ensure long-term reliability.
This part belongs to the TC series of audio and signal transformers from Mini-Circuits. The series offers various impedance ratios and frequency ranges for different circuit needs. The TC3-1T+ specifically addresses applications requiring a 1:3 ratio within the VHF band. It represents a standard solution for balanced line interfacing in RF designs.
The TC3-1TX+ is an upgraded version featuring an additional top hat structure. This variant maintains similar functional parameters while potentially offering enhanced mechanical or electrical characteristics. Verify pinout compatibility and dimensional tolerances before substituting.
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