SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TC646EOA713 is a PWM fan controller manufactured by Microchip Technology, designed for motor and motion control applications. It operates within a supply voltage range of 3 V to 5.5 V and draws a maximum operating current of 1 mA. The device supports system shutdown and fault detection features. It functions across an ambient temperature range from 0°C to +85°C. The component is housed in an 8-SOIC surface-mount package and carries a moisture sensitivity rating. It belongs to the TC646 series under the PMIC - Power Management ICs category.
Verify the specific suffix '713' indicates the reel packaging format as documented by the manufacturer. Confirm RoHS compliance status through official datasheets before integration. Ensure ESD handling protocols are followed due to moisture sensitivity classification. Cross-reference the full part number against Microchip's current product lifecycle status to confirm availability and active production status.
Select this component when a dedicated PWM fan controller with integrated fault detection is required. The 8-SOIC package suits space-constrained surface-mount designs. Verify that the 3 V to 5.5 V supply range aligns with the target system voltage. Consider the 0°C to +85°C operating temperature range against environmental requirements. Compare against other TC646 variants if different packaging or temperature grades are needed.
The TC646EOA713 is part of the TC646 family of fan controllers from Microchip Technology. This series focuses on providing reliable PWM control with diagnostic features. The 'E' typically denotes the commercial temperature grade, while 'OA713' specifies the SOIC-8 package and tape-and-reel delivery method. It serves as a specialized solution for managing cooling fans in embedded systems.
TC646VOA713 offers identical electrical specifications but may differ in manufacturing lot or minor packaging tolerances. TC646BEUA provides similar functionality in an MSOP package, requiring footprint adaptation. Verify pin compatibility and thermal performance when substituting with these alternatives.