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TC74LCX157FTELM is listed in the Signal Switches, Multiplexers, Decoders range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is IC MULTIPLEXER 4 X 2:1 16TSSOP. Review the specifications below when checking this part for your BOM.
The TC74LCX157FTELM is a low voltage quad 2-channel multiplexer manufactured by Toshiba Semiconductor and Storage. It operates within a supply voltage range of 1.65 V to 3.6 V and features 5 V tolerant inputs and outputs. The device provides a typical propagation delay of 5.8 ns and supports output drive currents of 24 mA for both high and low logic levels. It is housed in a 16-pin TSSOP package and is designed for surface mount installation.
Verify the complete part number including the suffix ELMT to ensure correct packaging configuration. Confirm RoHS compliance status through official Toshiba documentation prior to procurement. Ensure the supplier provides valid traceability records. Cross-reference the datasheet revision date to confirm technical specifications match current manufacturing standards. Validate that the component source is an authorized distributor to prevent counterfeit risks.
Select this component when a quad multiplexer is required for low voltage logic families. The 5 V tolerance feature makes it suitable for interfacing with legacy 5 V systems while operating at lower core voltages. Consider the TSSOP-16 package dimensions for PCB layout constraints. Evaluate the 24 mA drive capability against load requirements to ensure signal integrity without external buffering.
This component belongs to the LCX series of low voltage CMOS logic devices from Toshiba. The LCX family is characterized by fast switching speeds and wide operating voltage ranges. It serves as a general-purpose logic IC for data handling and signal routing applications in modern electronic designs requiring efficient power consumption and high performance.
The TC74LCX157FK is a confirmed substitute offering identical functionality in a US16 package. Verify pinout compatibility and package footprint differences before substitution. Ensure electrical parameters such as propagation delay and drive current remain within acceptable limits for the specific application design.
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