TC7SZ17FU,LJ(CT

Overview

The TC7SZ17FU,LJ(CT is a Schmitt trigger buffer manufactured by Toshiba Semiconductor and Storage. It operates within a supply voltage range of 1.65 V to 5.5 V and features push-pull outputs with high drive capability, supporting up to ±32 mA at VCC = 5.5 V. The device provides 5.5 V tolerant inputs and includes power-down protection for outputs. Designed for surface-mount applications in the USV (SOT-353) package, it ensures signal integrity through defined hysteresis characteristics.

Feature Summary

• Schmitt trigger input configuration for noise immunity
• High output current drive capability across wide voltage range
• Power-down protection on outputs prevents leakage during low-power states

Applications

• Signal buffering in portable electronic devices
• Clock distribution networks requiring fast switching speeds
• Level shifting between different logic families

Procurement Notes

Verify that the ordering suffix J(CT corresponds to the industrial temperature range of -40°C to +85°C. Confirm compliance with AEC-Q100 reliability standards if automotive qualification is required. Ensure packaging specifications match the intended automated assembly process requirements.

Selection Notes

Select this component when a single-channel non-inverting buffer with Schmitt trigger action is needed. It is suitable for designs requiring robust noise rejection and high-speed operation. Consider the USV package constraints for PCB layout and thermal management during selection.

Part Context

This part belongs to the TC7SZ series of L-MOS logic devices from Toshiba. It serves as a specialized buffer solution offering enhanced performance compared to standard logic buffers. The series is designed for low-voltage, high-speed digital applications in consumer and industrial electronics.

Replacement Considerations

Check pinout compatibility and electrical parameters against potential substitutes. Verify that alternative components support the same 1.65 V to 5.5 V operating range and Schmitt trigger functionality. Ensure package dimensions match the existing footprint.