SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TC9593XBG(EL) is an automotive-grade DSI-to-LVDS bridge IC manufactured by Toshiba Semiconductor and Storage. It converts MIPI DSI video streams to LVDS signals for display panels, supporting up to 4 data lanes at 1 Gbps/lane. The device handles dual-link LVDS output with a maximum pixel clock of 270 MHz, enabling WUXGA (1920x1200) resolution. It integrates an I2C Master controlled via DSI and supports RGB666/RGB888 formats. Power supplies include 1.2V for DSI/LVDS PHY and Core, and 1.8V or 3.3V for I/O. It is AEC-Q100 Grade 3 qualified (-40°C to 85°C) and housed in a 64-VFBGA package.
Verify the specific suffix 'EL' against official Toshiba documentation to confirm packaging details such as tape & reel specifications. Ensure the design accounts for the AEC-Q100 Grade 3 qualification limits (-40°C to 85°C) if operating in automotive environments. Confirm power supply sequencing requirements, particularly regarding the STBY pin and VDDIO voltage selection (1.8V or 3.3V).
Select the TC9593XBG over the TC9592XBG when dual-link LVDS output is required for resolutions exceeding 1600x1200 or for higher bandwidth needs. The TC9593XBG utilizes a 64-ball BGA package compared to the 49-ball variant. Ensure the host processor supports MIPI DSI Video Mode with Generic Long Write packets for register configuration.
This component succeeds the TC358764XBG/TC358765XBG series. Key updates include reduced LVDS Tx power consumption (1.8V @ 135 MHz), increased DSI Rx bit rate support (1 Gbps/lane), and the addition of a dedicated STBY pin for flexible power sequencing. It serves as a specialized interface bridge between mobile processors and LVDS displays.
The TC9592XBG is a functional alternative for single-link LVDS applications but lacks dual-link support. No other direct cross-model substitutes are documented in the provided specification.