TC9593XBG(EL)

TC9593XBG(EL)

$7.68
  • Description:IC BRIDGE 64VFBGA
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:4fa7f23993a8 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC BRIDGE 64VFBGA
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Type:Bridge
  • Applications:-
  • Mounting Type:Surface Mount
  • Package / Case:64-VFBGA
  • Supplier Device Package:64-VFBGA (6x6)
  • Grade:Automotive
  • Qualification:-

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TC9593XBG(EL)

Overview

The TC9593XBG(EL) is an automotive-grade DSI-to-LVDS bridge IC manufactured by Toshiba Semiconductor and Storage. It converts MIPI DSI video streams to LVDS signals for display panels, supporting up to 4 data lanes at 1 Gbps/lane. The device handles dual-link LVDS output with a maximum pixel clock of 270 MHz, enabling WUXGA (1920x1200) resolution. It integrates an I2C Master controlled via DSI and supports RGB666/RGB888 formats. Power supplies include 1.2V for DSI/LVDS PHY and Core, and 1.8V or 3.3V for I/O. It is AEC-Q100 Grade 3 qualified (-40°C to 85°C) and housed in a 64-VFBGA package.

Feature Summary

  • MIPI DSI Receiver: Supports 1-4 data lanes at max 1 Gbps/lane; accepts RGB565/666/888 formats.
  • Dual-Link LVDS Transmitter: Max 270 MHz pixel clock; supports up to 1920x1200@24bpp resolution.
  • Integrated I2C Master: Controlled by Host via DSI link for peripheral configuration.
  • Power Management: Includes Sleep state (ULPS) and Standby state (STBY pin); built-in PLL for LVDS clocking.

Applications

  • Automotive infotainment displays
  • Industrial control panel interfaces
  • WUXGA LVDS-compatible display modules

Procurement Notes

Verify the specific suffix 'EL' against official Toshiba documentation to confirm packaging details such as tape & reel specifications. Ensure the design accounts for the AEC-Q100 Grade 3 qualification limits (-40°C to 85°C) if operating in automotive environments. Confirm power supply sequencing requirements, particularly regarding the STBY pin and VDDIO voltage selection (1.8V or 3.3V).

Selection Notes

Select the TC9593XBG over the TC9592XBG when dual-link LVDS output is required for resolutions exceeding 1600x1200 or for higher bandwidth needs. The TC9593XBG utilizes a 64-ball BGA package compared to the 49-ball variant. Ensure the host processor supports MIPI DSI Video Mode with Generic Long Write packets for register configuration.

Part Context

This component succeeds the TC358764XBG/TC358765XBG series. Key updates include reduced LVDS Tx power consumption (1.8V @ 135 MHz), increased DSI Rx bit rate support (1 Gbps/lane), and the addition of a dedicated STBY pin for flexible power sequencing. It serves as a specialized interface bridge between mobile processors and LVDS displays.

Replacement Considerations

The TC9592XBG is a functional alternative for single-link LVDS applications but lacks dual-link support. No other direct cross-model substitutes are documented in the provided specification.

TC9593XBG(EL)TC9593XBG(EL)
$7.68
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