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The TCMT1119 is a single-channel optoisolator from Vishay Semiconductor Opto Division, featuring a phototransistor output coupled to a gallium arsenide infrared-emitting diode. It provides 3750Vrms isolation voltage and operates with a maximum collector-emitter voltage of 70V. The device supports an input current of 5mA and delivers an output current of 50mA per channel. Typical forward voltage is 1.15V, with a current transfer ratio ranging from 200% to 400%. Packaged in a 4-lead Miniflat surface-mount format, it ensures reliable signal transmission across isolated circuits.
Verify the specific ordering suffix against the official Vishay datasheet to confirm package type and tape/reel specifications. Confirm lead times directly with authorized distributors as manufacturing schedules may vary. Ensure compliance with RoHS directives if required by your application standards. Cross-reference the part number with the latest revision notes to avoid discrepancies in pinout or ratings.
Select this component when a single-channel phototransistor output is required with moderate current transfer capabilities. The 70V collector-emitter voltage rating suits low-to-medium voltage switching applications. Consider the 4-lead Miniflat package for space-constrained PCB layouts. Verify that the 5mA input drive current aligns with your source circuit capabilities before finalizing the design.
This component belongs to the TCMT111 series of optocouplers manufactured by Vishay Semiconductor Opto Division. The series utilizes a phototransistor output configuration paired with an infrared LED emitter. These devices are engineered for general-purpose isolation tasks where compact size and reliable performance are prioritized. The Miniflat packaging option facilitates automated surface-mount assembly processes.
Consult Vishay documentation for direct substitutes within the TCMT111 series. Verify pin compatibility and electrical ratings before substituting with generic equivalents. Ensure any replacement maintains the required 3750Vrms isolation level and matches the physical footprint for seamless integration.